Vishay SIP41111DYP-T1-E3

ECCN (US)

EAR99

Driver Type

High and Low Side

Driver Configuration

Non-Inverting

Bridge Type

Half Bridge

High and Low Sides Dependency

Independent

Maximum Rise Time (ns)

14(Typ)

Maximum Fall Time (ns)

15(Typ)

Maximum Propagation Delay Time (ns)

23(Typ)

Minimum Operating Supply Voltage (V)

9

Maximum Operating Supply Voltage (V)

13.2

Maximum Supply Current (mA)

3

Typical Input Low Threshold Voltage (V)

4.5

Typical Input High Threshold Voltage (V)

5.5

Peak Output Current(A)

2(Typ)

Maximum Power Dissipation (mW)

2000

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Special Features

Under Voltage Lockout

Standard Package Name

SOP

Supplier Package

SOIC N

Mounting

Surface Mount

Package Height

1.55(Max)

Package Length

5(Max)

Package Width

4(Max)

PCB changed

8

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

MOSFET

Pin Count

a count of all of the component leads (or pins)

8

Number of Outputs

2

Number of Drivers

2

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant