898-1-R330
DIP
32352967-898-1-R330
Res Thick Film NET 330 Ohm 2% 2W ±100ppm/C BUS Molded 16-Pin DIP Pin Thru-Hole Magazine Pack
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.
The center distance from one pole to the next.
the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.