898-1-R330

TT Electronics / BI Technologies 898-1-R330

Part No:

898-1-R330

Datasheet:

-

Package:

DIP

AINNX NO:

32352967-898-1-R330

Category:

Resistors

Description:

Res Thick Film NET 330 Ohm 2% 2W ±100ppm/C BUS Molded 16-Pin DIP Pin Thru-Hole Magazine Pack

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Package / Case
    DIP
  • Terminal Shape
    FLAT
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    THROUGH HOLE MOUNT
  • Number of Terminals
    16
  • Manufacturer Part Number
    898-1-R330
  • Rohs Code
    No
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    BI TECHNOLOGIES CORP
  • Package Description
    ,
  • Risk Rank
    8.76
  • Number of Elements
    15
  • Operating Temperature-Min
    -55 °C
  • Package Shape
    RECTANGULAR PACKAGE
  • Case Size
    Not Required
  • Package Type
    DIP
  • Power Rating Per Resistor
    0.125 (1/8)(W)
  • Product Depth (mm)
    8.64(mm)
  • Operating Temp Range
    -55C to 125C
  • No. of Terminals
    16
  • Case Style
    Molded
  • Mounting Styles
    Through Hole
  • Circuit Designator
    BUS
  • Case Size per Element
    NOT REQUIRED
  • Tolerance (+ or -)
    2%
  • Rad Hardened
    No
  • Seated Plane Height
    4.7(mm)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Magazine
  • Tolerance
    2%
  • JESD-609 Code
    e0
  • Pbfree Code
    Yes
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    100 ppm/°C
  • Type
    Network
  • Resistance
    330(ohm)
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Power Rating
    2(W)
  • Packing Method
    MAGAZINE
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54(mm)
  • Construction
    Rectangular
  • Resistor Type
    ARRAY/NETWORK RESISTOR
  • Reach Compliance Code
    compliant
  • Military Standard
    Not Required
  • Termination Style
    Pin
  • Rated Power Dissipation (P)
    2 W
  • Working Voltage
    100 V
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    Not Required
  • Rated Temperature
    125 °C
  • Number of Resistors
    15
  • Element Power Dissipation
    0.125 W
  • Network Type
    BUSSED
  • First Element Resistance
    330 Ω
  • Temperature Coefficient Tracking
    50 ppm/°C
  • Product Length (mm)
    22.4(mm)
  • Product Height (mm)
    3.18(mm)
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