TT Electronics/BI Magnetics HM31-10050LF

Factory Lead Time

17 Weeks

Mounting Type

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

HM31

Published

2009

Size / Dimension

0.787Lx0.591W 20.00mmx15.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Invasive

Termination Style

PC Pin

Inductance

5mH

DC Resistance (DCR)

700mOhm Max

ET (Volt-Time)

300VμS

Height Seated (Max)

0.787 20.00mm