Transcend Information TS16D42AR00SNSI

EU RoHS

Compliant

ECCN (US)

4A994.a

Module

DRAM Module

Module Density

16Gbyte

Chip Density (bit)

8G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

2400

Chip Configuration

1Gx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.14

Typical Operating Supply Voltage (V)

1.2

Maximum Operating Supply Voltage (V)

1.26

Operating Current (mA)

1170

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

ECC Support

Yes

Number of Ranks

Dual

SPD EEPROM Support

Yes

Mounting

Socket

Package Height

30

Package Length

69.6

PCB changed

260

Supplier Package

SODIMM

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

260

Organization

2Gx72

Module Type

260SODIMM