Toshiba Semiconductor and Storage TLP797J(F)

Factory Lead Time

12 Weeks

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

6-DIP (0.300, 7.62mm)

Number of Pins

6

Number of Elements

1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Series

TLP797J

Published

2011

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

PC Pin

Resistance

35Ohm

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

85°C

Min Operating Temperature

-40°C

Termination Style

PC Pin

Output Type

AC, DC

Max Output Current

The maximum current that can be supplied to the load.

100mA

Circuit

SPST-NO (1 Form A)

Number of Channels

1

Throw Configuration

SPST

Optoelectronic Device Type

TRANSISTOR OUTPUT SSR

Forward Current

Current which flows upon application of forward voltage.

7.5mA

Max Output Voltage

The maximum output voltage refers to the dynamic area beyond which the output is saturated in the positive or negative direction, and is limited according to the load resistance value.

600V

Max Input Voltage

1.3V

Rise Time

In electronics, when describing a voltage or current step function, rise time is the time taken by a signal to change from a specified low value to a specified high value.

200μs

Relay Type

Relay

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

1.3V

Fall Time (Typ)

200 μs

Voltage - Load

0V~600V

On-State Resistance (Max)

35Ohm

Max Input Current

50mA

Isolation Voltage-Max

5000V

Reverse Voltage (DC)

5V

Height

3.65mm

Length

7.12mm

Width

6.4mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant