Toshiba Semiconductor and Storage TL12W03-D(T30)

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

2-SMD, Flat Lead

Number of Pins

2

Shape

RECTANGULAR

Thermal Resistance of Package

8°C/W

CCT(K)

6500K (5650K ~ 8000K)

Operating Temperature (Max.)

100°C

Operating Temperature (Min.)

-40°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2009

Size / Dimension

0.276Lx0.197W 7.00mmx5.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

2

Color

White, Cool

Packing Method

TAPE AND REEL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

6.15mm

Base Part Number

TL12W03

Configuration

SINGLE WITH BUILT-IN ZENER DIODE

Max Current Rating

500mA

Voltage - Forward (Vf) (Typ)

3.3V

Optoelectronic Device Type

SINGLE COLOR LED

Current - Test

350mA

Lumens/Watt @ Current - Test

78 lm/W

Forward Current-Max

0.5A

Luminous Flux

the measure of the perceived power of light.

90 lm

Flux @ 25°C, Current - Test

90lm 67lm~113lm

Height Seated (Max)

0.089 2.25mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant