Toshiba Semiconductor and Storage TDTC114Y,LM

Mounting Type

Surface Mount

Package / Case

TO-236-3, SC-59, SOT-23-3

Supplier Device Package

SOT-23-3

Mfr

Toshiba Semiconductor and Storage

Package

Tape & Reel (TR)

Product Status

Active

Current-Collector (Ic) (Max)

100 mA

Pd - Power Dissipation

320 mW

Transistor Polarity

NPN

Typical Input Resistor

10 kOhms

Factory Pack QuantityFactory Pack Quantity

3000

Mounting Styles

SMD/SMT

Peak DC Collector Current

100 mA

Channel Mode

Enhancement

Manufacturer

Toshiba

Brand

Toshiba

Maximum DC Collector Current

100 mA

Collector- Emitter Voltage VCEO Max

50 V

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Cut Tape

Subcategory

Transistors

Configuration

Single

Power - Max

320 mW

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

BJTs - Bipolar Transistors - Pre-Biased

Transistor Type

NPN - Pre-Biased

DC Current Gain (hFE) (Min) @ Ic, Vce

79 @ 5mA, 5V

Current - Collector Cutoff (Max)

500nA

Vce Saturation (Max) @ Ib, Ic

300mV @ 500μA, 10mA

Voltage - Collector Emitter Breakdown (Max)

50 V

Frequency - Transition

250 MHz

Resistor - Base (R1)

10 kOhms

Continuous Collector Current

100 mA

Product Category

a particular group of related products.

Bipolar Transistors - Pre-Biased