TB67B000HG

Toshiba Semiconductor and Storage TB67B000HG

Part No:

TB67B000HG

Datasheet:

-

Package:

30-PowerDIP Module

ROHS:

AINNX NO:

5381594-TB67B000HG

Description:

IC MOTOR DRVR 13.5V-16.5V 30HDIP

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mount
    Through Hole
  • Mounting Type
    Through Hole
  • Package / Case
    30-PowerDIP Module
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -30°C~115°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Published
    2013
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Applications
    General Purpose
  • Voltage - Supply
    13.5V~16.5V
  • Function
    Driver - Fully Integrated, Control and Power Stage
  • Interface
    PWM
  • Output Configuration
    Half Bridge (3)
  • Logic Function
    AND
  • Voltage - Load
    50V~450V
  • Motor Type - AC, DC
    Brushless DC (BLDC)
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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