Toshiba Semiconductor and Storage SSM6N17FU(TE85L,F)

Factory Lead Time

12 Weeks

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Silver, Tin

Mount

Surface Mount

Mounting Type

Surface Mount

Package / Case

6-TSSOP, SC-88, SOT-363

Number of Pins

6

Current - Continuous Drain (Id) @ 25℃

100mA Ta

Number of Elements

2

Turn Off Delay Time

It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

40 ns

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

150°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

SMD/SMT

ECCN Code

EAR99

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

200mW

Element Configuration

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

Dual

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

200mW

Turn On Delay Time

Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

100 ns

Power - Max

200mW Ta

FET Type

2 N-Channel (Dual)

Rds On (Max) @ Id, Vgs

20 Ω @ 10mA, 4V

Vgs(th) (Max) @ Id

1.5V @ 1μA

Input Capacitance (Ciss) (Max) @ Vds

7pF @ 3V

Continuous Drain Current (ID)

100mA

Threshold Voltage

1.5V

Gate to Source Voltage (Vgs)

7V

Drain Current-Max (Abs) (ID)

0.1A

Dual Supply Voltage

50V

FET Technology

METAL-OXIDE SEMICONDUCTOR

FET Feature

Standard

Nominal Vgs

1.5 V

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant