TH50VSF2580AASB

Toshiba America Electronic Components TH50VSF2580AASB

Part No:

TH50VSF2580AASB

Datasheet:

Package:

-

AINNX NO:

69217571-TH50VSF2580AASB

Category:

Specialized

Description:

IC SPECIALTY MEMORY CIRCUIT, PBGA69, 12 X 9 MM, 0.80 MM PITCH, PLASTIC, FBGA-69, Memory IC:Other

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    69
  • Rohs Code
    No
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    TOSHIBA CORP
  • Part Package Code
    BGA
  • Package Description
    LFBGA, BGA69,10X12,32
  • Access Time-Max
    90 ns
  • Number of Words
    2097152 words
  • Number of Words Code
    2000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    LFBGA
  • Package Equivalence Code
    BGA69,10X12,32
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    3 V
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • ECCN Code
    EAR99
  • Terminal Finish
    TIN LEAD
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    69
  • JESD-30 Code
    R-PBGA-B69
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Supply Current-Max
    0.05 mA
  • Organization
    2MX16
  • Seated Height-Max
    1.4 mm
  • Memory Width
    16
  • Memory Density
    33554432 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Mixed Memory Type
    FLASH+SRAM
  • Length
    12 mm
  • Width
    9 mm
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