Toshiba America Electronic Components TBD62503AFG

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

16

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

TOSHIBA CORP

Package Description

SOP, SOP16,.25

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Equivalence Code

SOP16,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PDSO-G16

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Output Current-Max

0.25 A

Interface IC Type

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Driver Number of Bits

7