Toshiba America Electronic Components TA8406F

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

16

Rohs Code

No

Part Life Cycle Code

Obsolete

Ihs Manufacturer

TOSHIBA CORP

Part Package Code

SOIC

Package Description

0.300 INCH, 1 MM PITCH, HEAT SINK, PLASTIC, SOP-16

Common-mode Reject Ratio-Nom

90 dB

Operating Temperature-Max

75 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Supply Voltage-Nom (Vsup)

15 V

JESD-609 Code

e0

Terminal Finish

TIN LEAD

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

2

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

unknown

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

16

JESD-30 Code

R-PDSO-G16

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL EXTENDED

Supply Current-Max

20 mA

Amplifier Type

OPERATIONAL AMPLIFIER

Seated Height-Max

2.85 mm

Neg Supply Voltage-Nom (Vsup)

-15 V

Average Bias Current-Max (IIB)

0.7 μA

Input Offset Voltage-Max

7000 μV

Length

13 mm

Width

6.4 mm