Toshiba THNSNJ256G8NY4PAGB

Mounting Type

Through Hole

Package / Case

TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Supplier Device Package

TO-92

Current-Collector (Ic) (Max)

800mA

Interface Type

SATA-3.1 6 Gb/s

Memory Types

FLASH - NAND (MLC)

Usage Level

Commercial grade

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-55°C ~ 150°C (TJ)

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Base Part Number

BC327

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

3.3000 V

Interface

SATA-3.1 6 Gb/s

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256 GB

Power - Max

625mW

Transistor Type

PNP

DC Current Gain (hFE) (Min) @ Ic, Vce

100 @ 100mA, 1V

Current - Collector Cutoff (Max)

200nA

Vce Saturation (Max) @ Ib, Ic

700mV @ 50mA, 500mA

Voltage - Collector Emitter Breakdown (Max)

45V

Screening Level

Commercial

Frequency - Transition

260MHz

Form Factor

an aspect of design which defines and prescribes the size, shape, and other physical specifications of hardware components, particularly in electronics and electronic packaging

M.2 2280