Toshiba TC74HC221AFN

Mount

Through Hole

Number of Pins

8

Number of Terminals

8

RoHS

Non-Compliant

Supplier Package

SOL

Maximum Propagation Delay Time @ Maximum CL

210@2V/[email protected]/36@6V ns

Mounting

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

2 %

Termination

SIP

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

100 ppm/°C

Resistance

27 kΩ

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

125 °C

Min Operating Temperature

-55 °C

Power Rating

800 mW

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Pin Count

a count of all of the component leads (or pins)

16

Number of Resistors

4

Quiescent Current

The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.

4 µA

Logic Function

Multivibrator

Circuit Type

There are 5 Main Types of Electric Circuit – Close Circuit, Open Circuit, Short Circuit, Series Circuit and Parallel Circuit.

Bussed

Power Per Element

125 mW

High Level Output Current

High-level Output Current IOH The current flowing into the output at a specified high- level voltage. Low-level Output Current IOL The current flowing into the output at a specified low- level output voltage.

-5.2 mA

Low Level Output Current

The current into the output terminal with input conditions applied that, according to the product specification, will establish a low level at the output.

5.2 mA

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No