TB6608FNG(O.EL)

Toshiba TB6608FNG(O.EL)

Part No:

TB6608FNG(O.EL)

Manufacturer:

Toshiba

Datasheet:

-

Package:

-

AINNX NO:

31975964-TB6608FNG(O.EL)

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Minimum Operating Supply Voltage (V)
    2.7
  • Operating Supply Voltage (V)
    3.3
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    5.5
  • Maximum Operating Current (mA)
    6
  • Maximum Power Dissipation (mW)
    960
  • Minimum Operating Temperature (°C)
    -20
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    1.2
  • Package Width
    4.4
  • Package Length
    7(Max)
  • PCB changed
    20
  • Standard Package Name
    SOP
  • Supplier Package
    SSOP
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    Motor Driver
  • Pin Count

    a count of all of the component leads (or pins)

    20
  • Motor Type
    Stepper Motor
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