Toshiba CTS520,L3F(T

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Material

Si

Diode Element Material

SILICON

Number of Terminals

2

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

No

PPAP

No

Maximum DC Reverse Voltage (V)

30

Maximum Continuous Forward Current (A)

0.2

Peak Non-Repetitive Surge Current (A)

1

Peak Forward Voltage (V)

0.6

Peak Reverse Current (uA)

5

Maximum Diode Capacitance (pF)

16(Typ)

Maximum Power Dissipation (mW)

150

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

100

Mounting

Surface Mount

Package Width

0.6

Package Length

1

PCB changed

2

Supplier Package

CST

Peak Forward Voltage

0.6(V)

Operating Temperature Classification

INDUSTRIALC

Package Type

CST

Product Depth (mm)

0.6(mm)

Maximum Forward Current

200(mA)

Rev Curr

5(uA)

Operating Temp Range

-40C to 100C

Power Dissipation (Max)

150(mW)

Rad Hardened

No

Package Style

CHIP CARRIER

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Operating Temperature-Max

100 °C

Manufacturer Part Number

CTS520,L3F(T

Package Shape

RECTANGULAR

Manufacturer

Toshiba America Electronic Components

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

TOSHIBA CORP

Forward Voltage-Max (VF)

0.6 V

Risk Rank

1.56

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Small Signal Schottky Diode

Applications

GENERAL PURPOSE

Technology

SCHOTTKY

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

NO LEAD

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

2

JESD-30 Code

R-XBCC-N2

Configuration

Single

Diode Type

RECTIFIER DIODE

Forward Current

Current which flows upon application of forward voltage.

200(mA)

Output Current-Max

0.2 A

Forward Voltage

the amount of voltage needed to get current to flow across a diode.

0.6(V)

Number of Phases

1

Peak Reverse Current

The maximum voltage that a diode can withstand in the reverse direction without breaking down or avalanching.If this voltage is exceeded the diode may be destroyed. Diodes must have a peak inverse voltage rating that is higher than the maximum voltage that will be applied to them in a given application.

5(uA)

Rep Pk Reverse Voltage-Max

30 V

Peak Non-Repetitive Surge Current

1(A)

Non-rep Pk Forward Current-Max

1 A

Reverse Current-Max

5 µA

Reverse Test Voltage

30 V

Product Length (mm)

1(mm)