THEVAF84C

THine THEVAF84C

Part No:

THEVAF84C

Manufacturer:

THine

Datasheet:

-

Package:

66-TSSOP (0.400, 10.16mm Width)

AINNX NO:

40487112-THEVAF84C

Description:

THC63LVDF84C LVDS Evaluation Kit

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    66-TSSOP (0.400, 10.16mm Width)
  • Supplier Device Package
    66-TSOP II
  • Memory Types
    Volatile
  • Package
    Box
  • Mfr
    THine Solutions, Inc.
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Series
    --
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    Interface
  • Technology
    SDRAM - DDR
  • Voltage - Supply
    2.3 V ~ 2.7 V
  • Function
    LVDS, Receiver
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Mb (32M x 8)
  • Clock Frequency
    200MHz
  • Access Time
    700ps
  • Memory Format
    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Utilized IC / Part
    THC63LVDF84C
  • Supplied Contents
    Board(s)
  • Write Cycle Time - Word, Page
    15ns
  • Primary Attributes
    -
  • Embedded
    -
  • Secondary Attributes
    -
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