THAT 1203S08-UR

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

2000

Tradename

InGenius

Package Description

SOP,

Package Style

SMALL OUTLINE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

1203S08-UR

Supply Voltage-Nom (Vsup)

15 V

Package Code

SOP

Package Shape

RECTANGULAR

Part Life Cycle Code

Contact Manufacturer

Ihs Manufacturer

THAT CORP

Risk Rank

5.57

Series

1200

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Terminal Finish

NOT SPECIFIED

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

250

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PDSO-G8

Supply Voltage-Max (Vsup)

18 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

3 V

Analog IC - Other Type

ANALOG CIRCUIT

Seated Height-Max

1.73 mm

Neg Supply Voltage-Nom (Vsup)

-15 V

Neg Supply Voltage-Max (Vsup)

-18 V

Neg Supply Voltage-Min (Vsup)

-3 V

Width

3.9 mm

Length

4.89 mm