XLI98C-30-30-2.15

t-Global Technology XLI98C-30-30-2.15

Part No:

XLI98C-30-30-2.15

Manufacturer:

t-Global Technology

Datasheet:

-

Package:

-

AINNX NO:

45464698-XLI98C-30-30-2.15

Description:

XL25 CERAMIC 30X30MM W/LI98C ADH

Products specifications
  • Lifecycle Status
    Production (Last Updated: 6 days ago)
  • Mount
    Surface Mount
  • Material
    Ceramic
  • Shape
    Square
  • Package Cooled
    Assorted (BGA, LGA, CPU, ASIC...)
  • Material Finish
    -
  • Voltage, Rating
    200 V
  • RoHS
    Compliant
  • Package
    Box
  • Mfr
    t-Global Technology
  • Product Status
    Obsolete
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel
  • Series
    XL-25
  • Tolerance
    1 %
  • Number of Terminations
    2
  • Termination
    Solder
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    200 ppm/°C
  • Type
    Heat Spreader
  • Resistance
    130 kΩ
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125 °C
  • Min Operating Temperature
    -55 °C
  • Composition
    Power resistor, Thick Film
  • Power Rating
    500 mW
  • Case Code (Metric)
    5025
  • Case Code (Imperial)
    2010
  • ELV
    Compliant
  • Attachment Method
    Thermal Tape, Adhesive (Included)
  • Thermal Resistance @ Forced Air Flow
    -
  • Number of Resistors
    1
  • Shelf Life
    12 Months
  • Thermal Resistance @ Natural
    -
  • Power Dissipation @ Temperature Rise
    -
  • Width
    2.5 mm
  • Height
    550 µm
  • Length
    5 mm
  • Diameter
    -
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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