MSP430BT5190IZQWR

Texas Instruments MSP430BT5190IZQWR

Part No:

MSP430BT5190IZQWR

Manufacturer:

Texas Instruments

Package:

113-VFBGA

ROHS:

AINNX NO:

7626522-MSP430BT5190IZQWR

Description:

MCU 16-bit MSP430 MSP430 RISC 256KB Flash 2.5V/3.3V 113-Pin BGA MICROSTAR JUNIOR T/R

Products specifications
  • Lifecycle Status
    ACTIVE (Last Updated: 5 days ago)
  • Factory Lead Time
    6 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    113-VFBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    113
  • Memory Types
    FLASH
  • Number of I/Os
    87
  • ROM(word)
    262144
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    MSP430
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    113
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Applications
    Bluetooth
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    IT ALSO OPERATES 1.8 V AT 8 MHZ MINIMUM SUPPLY
  • Voltage - Supply
    1.8V~3.6V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3V
  • Frequency
    25MHz
  • Pin Count

    a count of all of the component leads (or pins)

    113
  • Interface
    I2C, IrDA, SCI, SPI, UART/USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256kB
  • RAM Size
    16K x 8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Peripherals
    DMA, PWM
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH (256kB)
  • Bit Size
    16
  • Has ADC
    YES
  • DMA Channels
    YES
  • Data Bus Width
    16b
  • PWM Channels
    YES
  • DAC Channels
    NO
  • Number of Timers/Counters
    3
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Number of A/D Converters
    16
  • Format
    FIXED-POINT
  • Integrated Cache
    NO
  • RAM (words)
    16
  • Number of UART Channels
    0
  • Number of Serial I/Os
    4
  • Height
    1mm
  • Length
    7mm
  • Width
    7mm
  • Thickness
    740μm
  • REACH SVHC
    No SVHC
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Lead Free
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