Texas Instruments DLP3010FQK

Mounting Type

Surface Mount

Package / Case

57-BFCLGA

Number of Pins

57

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Digital Micromirror Device (DMD)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

75°C

Min Operating Temperature

-20°C

Applications

Image Processing and Control

Base Part Number

DLP3010

Resolution (height)

720 pixel

Resolution (width)

1280 pixel

Height

4mm

Length

18.2mm

Width

7mm

Thickness

3.78mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free