Texas Instruments 1740281

Mounting Type

Surface Mount

Package / Case

18-UFQFN Exposed Pad

Supplier Device Package

18-QFN (3x3)

Series

*

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active