Texas Instruments 1607890

Package / Case

SOGN

Case Size

Not Required

Package Type

SOGN

Power Rating Per Resistor

0.24(W)

Product Depth (mm)

6(mm)

Operating Temp Range

-55C to 125C

No. of Terminals

16

Case Style

Ceramic

Mounting Styles

Surface Mount

Temperature Range @ Derated Power

70 TO 125

Circuit Designator

ISOL

Case Size per Element

NOT REQUIRED

Tolerance (+ or -)

2%

Rad Hardened

No

Seated Plane Height

1.55(mm)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

±200(ppm/°C)

Type

Network

Resistance

27(ohm)

Power Rating

1.8(W)

Technology

Thick Film

Terminal Pitch

The center distance from one pole to the next.

1.27(mm)

Construction

Rectangular

Military Standard

Not Required

Termination Style

Gull Wing

Failure Rate

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

Not Required

Number of Resistors

8

Product Length (mm)

9.9(mm)

Product Height (mm)

1.37(mm)