Temic Semiconductors BZW03C39

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Terminals

2

Part Life Cycle Code

Transferred

Ihs Manufacturer

TEMIC SEMICONDUCTORS

Breakdown Voltage-Nom

54.1 V

Number of Elements

1

Operating Temperature-Max

175 °C

Package Body Material

GLASS

Package Shape

ROUND

Package Style

LONG FORM

Power Dissipation (Max)

1.85 W

Terminal Position

AXIAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

WIRE

Reach Compliance Code

unknown

JESD-30 Code

O-LALF-W2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

UNIDIRECTIONAL

Configuration

SINGLE

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Case Connection

ISOLATED

Non-rep Peak Rev Power Dis-Max

1000 W

Reverse Current-Max

10 µA