TEMIC BZX55C-9V1

Lifecycle Status

Production (Last Updated: 1 week ago)

Mount

Axial, Through Hole

Voltage, Rating

200 V

RoHS

Compliant

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Box (TB)

Tolerance

5 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

90 ppm/°C

Resistance

16 Ω

Composition

Power resistor, Wirewound

Power Rating

3 W

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

3 W

ELV

Compliant

Number of Resistors

1

Length

13.0048 mm

Diameter

5.7 mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No