Telit JF2-C0C7-DR

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

32

EU RoHS

Compliant

Automotive

No

PPAP

No

Mounting

Surface Mount

Package Height

2.8(Max)

Package Width

11

Package Length

11

PCB changed

32

Standard Package Name

LGA

Supplier Package

LGA Module

Lead Shape

No Lead

Package Description

LGA,

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

J-F2-C0C7-DR

Package Code

LGA

Package Shape

SQUARE

Manufacturer

Telit

Part Life Cycle Code

Contact Manufacturer

Ihs Manufacturer

TELIT COMMUNICATIONS PLC

Risk Rank

5.68

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BUTT

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

32

JESD-30 Code

S-PBGA-B32

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Seated Height-Max

2.8 mm

Telecom IC Type

TELECOM CIRCUIT

Width

11 mm

Length

11 mm