Teledyne LeCroy T911855ACC

RoHS

Non-Compliant

Factory Pack QuantityFactory Pack Quantity

1

Manufacturer

Teledyne FLIR

Brand

Teledyne FLIR

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Tolerance

0.5 %

Number of Terminations

2

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

50 ppm/°C

Resistance

2.32 kΩ

Composition

Metal Film

Subcategory

Cable Assemblies

Power Rating

250 mW

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

250 mW

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ethernet Cables / Networking Cables

Features

Military, Moisture Resistant, Weldable

Product Category

a particular group of related products.

Ethernet Cables / Networking Cables

Width

2.46 mm

Length

7.112 mm

Lead Free

Contains Lead