Teledyne LeCroy CCS-18N37C

Mounting Type

Surface Mount

Mated Stacking Heights

1mm

RoHS

Compliant

Series

Fine Stack (FS)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Connector Type

Receptacle, Center Strip Contacts

Number of Positions

40

Number of Rows

2

Pitch

0.016 (0.40mm)

Contact Finish

Gold

Max Frequency

8 GHz

Features

Solder Retention

Contact Finish Thickness

3.90µin (0.099µm)

Height Above Board

0.037 (0.95mm)

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No