TE Connectivity Linx L000643-01

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bag

Size / Dimension

43.70mm L x 41.16mm W x 0.33mm H

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Frequency

13.56MHz

Features

Near Field Communications (NFC)