TE Connectivity AMP Connectors 210812-8

Mount

Through Hole

Mounting Type

Through Hole

Housing Material

GLASS FILLED POLYETHYLENE POLYESTER

Contact Materials

BRASS

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

JESD-609 Code

e4

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

DIP, DIL - Header

Number of Positions

8

Number of Rows

2

Contact Type

Male Pin

Pitch

0.100 2.54mm

Reach Compliance Code

unknown

Contact Finish

Gold

Number of Contacts

8

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

0.300 (7.62mm)

Device Socket Type

IC SOCKET

Width

7.6mm

Contact Finish Thickness

10.0μin 0.25μm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free