TE Connectivity AMP Connectors 1-1102100-7

Factory Lead Time

19 Weeks

Mount

Surface Mount

Material

Zinc

Housing Material

Zinc, Die Cast

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

HA.3, HTS

Published

2005

Size / Dimension

1.043Lx1.043W x 2.047 H 26.50mmx26.50mmx52.00mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Connector Type

Hood

Color

Grey, Silver

Orientation

Straight

Depth

52mm

Style

Top Entry

Housing Color

Gray

Size

1

Thread Size

given in nominal sizes, not in the actual measurement.

PG11

Lock Location

Locking Clip (1) on Base Bottom

Housing Finish

Powder Coated

Height

52mm

Length

26.5mm

Width

32.9946mm

REACH SVHC

Unknown

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant