TE Connectivity / AMP D-306-38

Material

Polyvinylidene Fluoride (PVDF)

RoHS

Details

Inside Diameter

3.3 mm

Recovered Diameter

1.3 mm

Maximum Temperature

+ 150 C

Factory Pack QuantityFactory Pack Quantity

1000

Part # Aliases

630050-000

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Wire Splice

Color

Black

Shrink Ratio

-

Length

10.16 mm