TE Connectivity / AMP 211014-1

Mounting Type

BOARD

Number of Pins

78

Shell Material

Steel

Panel Mount

NO

Contact Finish Mating

NOT SPECIFIED

Contact Materials

Copper

Insulation Materials

POLYTETRAFLUORO ETHYLENE

Mounting Styles

RIGHT ANGLE

Operating Frequency (Max)

4GHz

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Pbfree Code

no

Connector Type

RF SMB CONNECTOR

Gender

Receptacle

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Option

GENERAL PURPOSE

Reach Compliance Code

unknown

Body/Shell Style

JACK

ELV

Non-Compliant

Termination Type

SOLDER

Plating

Cadmium

Coupling Type

SNAP

Hole Diameter

3.05 mm

Characteristic Impedance

75Ohm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Not Applicable