ZEN132V130A24YC

TE Connectivity ZEN132V130A24YC

Part No:

ZEN132V130A24YC

Manufacturer:

TE Connectivity

Datasheet:

-

Package:

-

AINNX NO:

31953858-ZEN132V130A24YC

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    No
  • PPAP
    No
  • Minimum Breakdown Voltage (V)
    13.2
  • Maximum Breakdown Voltage (V)
    13.8
  • Test Current (mA)
    100
  • Capacitance Value (pF)
    4200(Typ)
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    1.4(Max)
  • Package Width
    5.2(Max)
  • Package Length
    4.2(Max)
  • PCB changed
    3
  • RoHS
    Non-Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    Polymer
  • Pin Count

    a count of all of the component leads (or pins)

    3
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