TE Connectivity MC612PA U1-U2-U3-V1-V2-V3-W1-W2-W3 HORIZ

Number of Pins

-

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N30

Unit Weight

0.564383 oz

Factory Pack QuantityFactory Pack Quantity

900

Inside Diameter

-

Part # Aliases

B66317G X130 E25/13/7 B66317G0000X130

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

Maximum DC Resistance

-

Inside Height

8.7 mm

Inside Length

17.5 mm

RoHS

Details

Outside Length

25 mm

For Use With

Terminal Blocks

Series

B66317G

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

- 20 %, + 30 %

Type

Ungapped

Color

White

Subcategory

Ferrites

Termination Style

-

Lead Spacing

the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

-

Lead Diameter

-

Inductance

2.9 uH

Core Size

25 x 13 x 7 (EF 25)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories