M83726/29-3001P

TE Connectivity M83726/29-3001P

Part No:

M83726/29-3001P

Manufacturer:

TE Connectivity

Datasheet:

-

Package:

QFN

AINNX NO:

36801478-M83726/29-3001P

Category:

Accessories

Description:

Time Delay & Timing Relays TD229-3001P TDFR 3 SEC

Products specifications
  • Package / Case
    QFN
  • Product Depth (mm)
    2(mm)
  • Operating Temp Range
    -40C to 85C
  • Mounting Styles
    Surface Mount
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Part # Aliases
    2-1617805-9
  • Manufacturer
    TE Connectivity
  • Brand
    TE Connectivity
  • Usage Level
    Industrial grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Subcategory
    Relays
  • Pin Count

    a count of all of the component leads (or pins)

    4
  • Screening Level
    INDUSTRIALC
  • Product Category

    a particular group of related products.

    Time Delay & Timing Relays
  • Product Length (mm)
    1.6(mm)
  • Product Height (mm)
    0.75(mm)
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