TE Connectivity K4Y50084UE-JCB3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

100

Manufacturer Part Number

K4Y50084UE-JCB3

Rohs Code

Yes

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

BGA, BGA100,11X16,50/32

Risk Rank

5.84

Access Time-Max

35 ns

Moisture Sensitivity Levels

3

Number of Words

67108864 words

Number of Words Code

64000000

Operating Temperature-Max

100 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA100,11X16,50/32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY

Supply Voltage-Nom (Vsup)

1.8 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Pbfree Code

Yes

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

unknown

JESD-30 Code

R-PBGA-B100

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.8 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Current-Max

1.02 mA

Organization

64MX8

Output Characteristics

3-STATE

Memory Width

8

Standby Current-Max

0.04 A

Memory Density

536870912 bit

I/O Type

COMMON

Memory IC Type

RAMBUS DRAM

Refresh Cycles

32768