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TE Connectivity 63506-1
63506-1
84-VFBGA
39144172-63506-1
Crimp Terminal 22-29AWG F Tin
- Lifecycle StatusProduction (Last Updated: 4 days ago)
- Mounting TypeSurface Mount
- Package / Case84-VFBGA
- Contact Plating
Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.
Tin - Supplier Device Package84-FBGA (11.6x8)
- MaterialBrass
- Body MaterialBrass
- Terminal MaterialBrass
- PackageTray
- Base Product NumberS29WS512
- MfrInfineon Technologies
- Product StatusObsolete
- Memory TypesNon-Volatile
- Wire Size29 to 22, 29 AWG
- Inside Diameter635 µm
- Contact MaterialsBrass
- RoHSCompliant
- Unit Weight0.006349 oz
- Factory Pack QuantityFactory Pack Quantity10000
- Mounting StylesPush In
- Wire Gauge Min29 AWG
- Wire Gauge Max22 AWG
- ManufacturerTE Connectivity
- BrandTE Connectivity / AMP
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-25°C ~ 85°C (TA) - SeriesWS-R
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape & Reel (TR) - TerminationReceptacle
- TypeCrimp Terminal
- GenderReceptacle
- SubcategoryTerminals
- TechnologyFLASH - NOR
- Voltage - Supply1.7V ~ 1.95V
- OrientationStraight
- Termination StyleCrimp
- ELVCompliant
- PlatingTin
- Memory Size
The memory capacity is the amount of data a device can store at any given time in its memory.
512Mbit - Wire Gauge (Max)29 AWG
- Wire Gauge (Min)22 AWG
- Clock Frequency104 MHz
- Access Time80 ns
- Memory FormatFLASH
- Memory Interface
An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.
Parallel - Write Cycle Time - Word, Page60ns
- Insulation Diameter1.52 mm
- InsulationInsulated
- Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
Terminals - Wire/Cable Diameter1.52 mm
- Stud/Tab Size1.57 mm
- Insulated Wire SupportNo
- Heavy DutyNo
- ProductBarrel Terminals
- Product Category
a particular group of related products.
Terminals - Memory Organization32M x 16
- Length19.17 mm
- Material Thickness
A measure of the distance between two surfaces of an object
406.4 µm - Lead FreeNot Applicable
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