
4700-09K18BB999
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44236307-4700-09K18BB999
XFRMR LAMINATED 100VA CHAS MOUNT
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Dissipation factor (DF) is a measure of loss-rate of energy of a mode of oscillation (mechanical, electrical, or electromechanical) in a dissipative system. It is the reciprocal of quality factor, which represents the "quality" or durability of oscillation.
In electronics, a center tap (CT) is a contact made to a point halfway along a winding of a transformer or inductor, or along the element of a resistor or a potentiometer.