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TE Connectivity 4-552008-2
Part No:
4-552008-2
Manufacturer:
Datasheet:
Package:
-
AINNX NO:
68650547-4-552008-2
Description:
Connector Accessories Strain Relief Cover Kit Polyphenylene Oxide Almond Bulk
Products specifications
- Body OrientationStraight
- Product Depth (mm)39.5(mm)
- Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Bulk - TypeStrain Relief Cover
- Product Length (mm)64.01(mm)
- Product Height (mm)15.37(mm)
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