4000Y09J15K999
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51279958-4000Y09J15K999
XFRMR LAMINATED 75VA CHAS MOUNT
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
In electronics, a center tap (CT) is a contact made to a point halfway along a winding of a transformer or inductor, or along the element of a resistor or a potentiometer.