2199260-5
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38290718-2199260-5
Micro SI-SIM Inline Combo Connector with One Guide Push-Push Type 8-Position Thermoplastic Black T/R
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
5-2308107-2
TE ConnectivityDIMM Sockets1-2308107-7
TE ConnectivityDIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder Mount, Vertical Module Orientation1-2308107-5
TE ConnectivityDIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder Mount, Vertical Module OrientationF269
TE ConnectivityMC 16bit 5V 256kB Flash 40MHz PQFP14460H1-15-14-2-Z-A
TE Connectivity60H1-15-14-2-Z-A2-2308107-3
TE ConnectivityDIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder Mount, Vertical Module Orientation2296830-2
TE Connectivity2296830-21376727-1
TE ConnectivityMemory Connectors DIMM Connectors FAX MODEM 124P L/PRO S/H/TRAY60D1-14-05-1-ZB-A
TE ConnectivityMemory Metal Ring Adaptor for MIL-DTL-26482 Series I, PATT 105 and PATT 603 Connectors 14 Shell Size1-2308107-8
TE ConnectivityDIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder Mount, Vertical Module Orientation