TE Connectivity 2198339-3

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Gold

Housing Material

Liquid Crystal Polymer (LCP)

Factory Pack QuantityFactory Pack Quantity

5

Manufacturer

Positronic

Brand

Amphenol Positronic

Contact Materials

Copper Alloy

RoHS

Details

Series

zSFP+

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Type

zSFP+

Gender

Female

Subcategory

D-Sub Connectors

Termination Style

Press Fit

Number of Ports

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

12 Port

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Mixed Contact D-Sub Connectors

Product

Connectors

Features

Stacked, with EMI gasket and inner light pipes

Product Category

a particular group of related products.

D-Sub Mixed Contact Connectors

Flammability Rating

UL 94 V-0