207467-2

TE Connectivity 207467-2

Part No:

207467-2

Manufacturer:

TE Connectivity

Datasheet:

-

Package:

QFN

AINNX NO:

36829758-207467-2

Description:

Connector Accessories Backshell/Cable Clamp Thermoplastic Bulk

Products specifications
  • Package / Case
    QFN
  • Shell Material
    Steel
  • Product Depth (mm)
    5(mm)
  • Operating Temp Range
    0C to 70C
  • Mounting Styles
    Surface Mount
  • Number of Cable Entries
    1 Entry
  • Shell Sizes
    1 (E)
  • Cable Entry Angle
    90 deg
  • Unit Weight
    0.266318 oz
  • Factory Pack QuantityFactory Pack Quantity
    1
  • Manufacturer
    TE Connectivity
  • Brand
    TE Connectivity / AMP
  • Tradename
    AMPLIMITE
  • RoHS
    Details
  • Filtered
    -
  • Usage Level
    Commercial grade
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Type
    Two Piece Backshell
  • Number of Positions
    9 Position
  • Subcategory
    D-Sub Connectors
  • Pin Count

    a count of all of the component leads (or pins)

    6
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    D-Sub Backshells
  • Screening Level
    COMMERCIALC
  • Product Category

    a particular group of related products.

    D-Sub Backshells
  • IP Rating

    IP (or "Ingress Protection") ratings are defined in international standard EN 6529 (British BS EN 6529:1992, European IEC 659:1989). They are?used to define levels of sealing effectiveness of electrical enclosures against intrusion from foreign bodies?(tools, dirt etc) and moisture.

    -
  • Product Length (mm)
    7(mm)
  • Product Height (mm)
    0.9(mm)
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