2063487-2
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46705780-2063487-2
TE Connectivity Crimp Die, AMP TYPE III+
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a measure of a material's ability to?conduct heat.?
A cable group describes the group of cables that are compatible with a particular contact.
a particular group of related products.