1623111-1

TE Connectivity 1623111-1

Part No:

1623111-1

Manufacturer:

TE Connectivity

Package:

0805

AINNX NO:

32168250-1623111-1

Description:

Res Thick Film 0805 130 Ohm 1% 0.125W(1/8W) ±100ppm/C Pad SMD T/R

Products specifications
  • Package / Case
    0805
  • Number of Terminals
    2
  • Tolerance (+ or -)
    1%
  • Operating Temp Range
    -55C to 155C
  • Case Style
    Molded
  • Product Depth (mm)
    1.25(mm)
  • Case Size
    0805
  • Product Diameter (mm)
    Not Required(mm)
  • Lead Spacing (nom)
    Not Required(mm)
  • Anti-Surge
    NO
  • Package Type
    SMD
  • Anti-Sulfurated
    NO
  • Power Rating(s)
    0.125 (1/8)(W)
  • Current Sensing

    Current sensing refers to the generation of the voltage signal which is related to the current passing in the circuit.

    NO
  • Temperature Range @ Derated Power
    70 TO 155
  • Package
    Box
  • Mfr
    TE Connectivity Passive Product
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Series
    *
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±100(ppm/°C)
  • Type
    Thick Film
  • Resistance
    130(ohm)
  • Construction
    Rectangular
  • Military Standard
    Not Required
  • Termination Style
    PAD
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    Not Required
  • Product Length (mm)
    2(mm)
  • Product Height (mm)
    0.55(mm)
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