TE Connectivity 1457019-3

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

RoHS

Non-Compliant

Series

pushPIN™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

ELV

Not Applicable

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.394 (10.00mm)

Thermal Resistance @ Forced Air Flow

20.27°C/W @ 100 LFM

Thermal Resistance @ Natural

--

Power Dissipation @ Temperature Rise

--

Width

1.772 (45.00mm)

Length

1.772 (45.00mm)

Diameter

--

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

Lead Free

Not Applicable