TE Connectivity 144684-1

Housing Material

Polyamide (PA)

RoHS

Non-Compliant

For Use With

COVER MODU IV

Housing Gender

-

Unit Weight

0.006385 oz

Factory Pack QuantityFactory Pack Quantity

2500

Contact Materials

-

Manufacturer

TE Connectivity

Brand

TE Connectivity / AMP

Tradename

AMPMODU

Series

AMPMODU MOD IV

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Type

Cover

Subcategory

Headers & Wire Housings

Contact Type

-

Housing Color

Black

Accessory Type

Cover

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Headers & Wire Housings

Product

Accessories

Product Category

a particular group of related products.

Headers & Wire Housings