TE Connectivity 1-331366-1

Package / Case

QFN

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Material

Copper

Product Depth (mm)

3.2(mm)

Operating Temp Range

-40C to 105C

Mounting Styles

Surface Mount

Voltage, Rating

300 VAC

Unit Weight

0.024022 oz

Factory Pack QuantityFactory Pack Quantity

5000

Wire Gauge Min

22 AWG

Contact Materials

Copper

Wire Gauge Max

16 AWG

Manufacturer

TE Connectivity

Brand

TE Connectivity

Tradename

PIDG

RoHS

Details

Insulation Materials

Nylon

Usage Level

Industrial grade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

PIDG

Type

Flanged Spade

Color

Red

Subcategory

Terminals

Pin Count

a count of all of the component leads (or pins)

4

Termination Style

Crimp

Insulation

Insulated

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Terminals

Screening Level

Industrial

Stud/Tab Size

# 10

Product

Screw Terminals

Product Category

a particular group of related products.

Terminals

Product Length (mm)

5(mm)

Product Height (mm)

0.75(mm)