TE Connectivity 130572

Lifecycle Status

Production (Last Updated: 3 weeks ago)

Material

Copper

RoHS

Non-Compliant

Insulation Materials

Nylon

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Color

Blue

Plating

Tin

Sealable

No

Insulation

Non-Insulated

Insulated Wire Support

No

Heavy Duty

No

Stud Diameter

3.0226 mm

Government Qualified

No

Length

20.2946 mm

Material Thickness

A measure of the distance between two surfaces of an object

787.4 µm

Tongue Thickness

810 µm